Our capabilities include:

• Circuit design and layout
  • 1-16 layer PCB’s
  • SMD reflow soldering
• Embedded programming
  • C/C++
  • Assembly
  • SystemVerilog
• Full documentation
  • Schematics
  • Bill of Materials
  • Component placement guides
  • Program flow charts
  • 3-D renderings
• Liquid resin 3-D printing for custom prototype enclosures and mechanical parts
  • Tough ABS-like plastic resin
  • Hybrid resins for combined strength and flexibility
  • Vulcanized rubber-like resin
  • Silicon-like resin
  • Ceramic resin